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Liquid Cooling Technologies: How Modern Data Centres Remove Heat Efficiently

  • Writer: MTS DNC ENERGY CONSULTANTS LIMITED
    MTS DNC ENERGY CONSULTANTS LIMITED
  • 3 days ago
  • 6 min read
HVAC design for data center Dublin Ireland illustrating direct-to-chip cooling, immersion cooling and coolant distribution systems
HVAC Design for Data Center Dublin, Ireland – Direct-to-Chip and Immersion Cooling Systems

As rack power densities continue to increase, data centre designers are moving away from relying solely on air cooling. Instead, they are adopting liquid cooling solutions that remove heat much closer to the source, significantly improving efficiency and reducing overall energy consumption.

Today, three liquid cooling technologies dominate the market:

  • Direct-to-Chip Cooling

  • Immersion Cooling

  • Rear-Door Heat Exchangers

Each technology offers distinct advantages depending on the facility type, IT equipment, cooling strategy, and operational requirements.


1. Direct-to-Chip Cooling

Direct-to-Chip (D2C), sometimes referred to as Cold Plate Cooling or Direct Liquid Cooling (DLC), is currently the fastest-growing liquid cooling technology.

Instead of cooling the surrounding air, cold plates are mounted directly onto the components that generate the greatest amount of heat, typically:

  • CPUs

  • GPUs

  • AI accelerators

  • High-performance memory modules

A coolant circulates through small channels inside the cold plate, absorbing heat before transferring it to a Coolant Distribution Unit (CDU).


How Direct-to-Chip Cooling Works

The process is relatively straightforward:

  1. Chilled coolant leaves the CDU.

  2. The coolant enters cold plates attached to processors.

  3. Heat transfers directly from the chip into the coolant.

  4. Warm coolant returns to the CDU.

  5. The CDU rejects the heat to the facility water system.

  6. The cooled liquid recirculates through the system.

Because heat is removed directly from the processor, thermal resistance is dramatically reduced compared with conventional air cooling.


Advantages of Direct-to-Chip Cooling

✔ Excellent cooling performance for AI workloads

✔ Lower server fan speeds

✔ Reduced energy consumption

✔ Easier maintenance than immersion systems

✔ Compatible with many existing server platforms

✔ Straightforward retrofit into existing facilities


Limitations

Direct-to-chip cooling typically removes 60–80% of the total server heat.

Remaining components still require some air cooling, including:

  • Memory modules

  • Power supplies

  • Hard drives

  • Network switches

For this reason, Direct-to-Chip systems often operate alongside traditional air cooling.


2. Immersion Cooling

Immersion cooling represents the most advanced form of liquid cooling currently available.

Rather than cooling individual components, the entire server is submerged inside a specially engineered dielectric liquid that does not conduct electricity.

Because every electronic component is surrounded by coolant, heat is removed uniformly across the entire server.

No internal server fans are required.


Single-Phase Immersion Cooling

In a single-phase system:

  • Servers remain submerged in liquid.

  • The coolant never boils.

  • Pumps circulate the warm liquid through external heat exchangers.

  • Cooled liquid returns to the immersion tank.

The cooling process is simple, reliable, and highly efficient.


Two-Phase Immersion Cooling

Two-phase immersion introduces an additional thermodynamic advantage.

The dielectric fluid has a very low boiling point.

When hot electronic components transfer heat into the fluid:

  • The liquid boils.

  • Vapour rises naturally.

  • Vapour condenses on cooling coils.

  • Condensed liquid falls back into the tank.

This process exploits the latent heat of vaporisation, allowing enormous quantities of heat to be removed with very little temperature increase.

The result is exceptional thermal performance.


Advantages of Immersion Cooling

✔ Extremely high cooling capacity

✔ Uniform temperatures across all components

✔ No server fans

✔ Minimal HVAC requirements

✔ Excellent support for future AI hardware

✔ Very low operating noise

✔ Outstanding energy efficiency


Challenges

Despite its impressive performance, immersion cooling presents several challenges.

These include:

  • Higher capital cost

  • Specialist maintenance procedures

  • Dedicated server hardware

  • Fluid management

  • Training requirements for maintenance staff

  • Reduced familiarity among operators

Although immersion cooling is expected to become increasingly common, it remains primarily used in hyperscale AI facilities and supercomputing applications.


3. Rear-Door Heat Exchangers

Rear-Door Heat Exchangers (RDHx) provide an excellent compromise between traditional air cooling and full liquid cooling.

Instead of cooling processors directly, a liquid-cooled heat exchanger replaces the rear door of the server cabinet.

Server fans continue moving air through the equipment.

However, before the warm air enters the room, it passes through the rear-door coil where heat is absorbed by circulating water.

Only cooled air leaves the rack.


Advantages

✔ Simple retrofit solution

✔ Minimal server modifications

✔ Reduced room cooling demand

✔ Lower fan energy

✔ Compatible with existing facilities


Limitations

Rear-door heat exchangers still depend upon server airflow.

They cannot remove heat as efficiently as Direct-to-Chip or immersion systems and therefore are generally suited to medium-density racks rather than extreme AI deployments.


Hybrid Cooling Systems

Rather than replacing every air-cooled rack, many modern data centres combine multiple cooling technologies.

This hybrid approach is rapidly becoming the preferred engineering solution.

A typical arrangement might include:

Equipment

Cooling Method

AI GPU Clusters

Direct-to-Chip

HPC Servers

Direct-to-Chip

Legacy Servers

Air Cooling

Storage Systems

Air Cooling

Network Equipment

Rear-Door Heat Exchangers

This strategy allows operators to modernise their facilities without completely rebuilding them.

It also reduces capital expenditure while improving overall energy efficiency.


Understanding Coolant Distribution Units (CDUs)

The Coolant Distribution Unit (CDU) is the heart of every liquid cooling installation.

It performs the same function that an Air Handling Unit performs within an HVAC system.

Its primary responsibilities include:

  • Pumping coolant

  • Controlling flowrate

  • Maintaining pressure

  • Monitoring temperatures

  • Removing heat through heat exchangers

  • Protecting IT equipment

Without a CDU, liquid cooling cannot operate safely.


Primary and Secondary Cooling Loops

Most liquid-cooled data centres use two independent water circuits.


Primary Loop (Facility Water System)

The primary loop rejects heat from the building.

Typical heat rejection equipment includes:

  • Dry coolers

  • Cooling towers

  • Adiabatic coolers

  • Chiller systems

The water quality within this circuit is similar to conventional building services installations.


Secondary Loop (Technology Cooling System)

The secondary loop circulates coolant directly to the IT equipment.

This loop normally contains:

  • Treated water

  • Water-glycol mixtures

  • Corrosion inhibitors

  • Filtration systems

The coolant quality is tightly controlled because it comes into close proximity with expensive electronics.

The CDU hydraulically separates these two systems using an internal plate heat exchanger.

This prevents contamination while allowing heat transfer between the loops.


Why Water Quality Matters

Unlike traditional chilled water systems, liquid cooling requires carefully controlled water chemistry.

Poor water quality can cause:

  • Corrosion

  • Scale formation

  • Biological growth

  • Reduced heat transfer

  • Equipment damage

For this reason, ASHRAE defines several water quality classifications.


ASHRAE Environmental Classes Explained

ASHRAE TC 9.9 has developed internationally recognised guidance for liquid-cooled data centres.

The three principal classifications are:


Water Quality Classes

These define coolant purity.

Class

Typical Application

W1

Ultra-pure water for Direct-to-Chip systems

W2

Controlled water chemistry

W3

Building water loops

W4

Facility cooling systems

Higher purity generally means greater protection for sensitive IT equipment.


Water Temperature Classes

ASHRAE also specifies maximum supply temperatures.

Examples include:

Class

Maximum Supply Temperature

W17

17°C

W27

27°C

W32

32°C

W40

40°C

W45

45°C

Higher water temperatures provide several advantages:

  • Reduced chiller operation

  • Increased free cooling

  • Lower energy consumption

  • Improved waste heat recovery

  • Better overall PUE

Modern liquid-cooled facilities increasingly operate at warmer temperatures than traditional chilled-water systems.


Surface Temperature Classes

Surface temperature classifications help prevent condensation.

When water temperatures fall below the surrounding dew point, condensation may form on pipework or IT equipment.

ASHRAE therefore defines acceptable operating limits to ensure reliable operation under different environmental conditions.


Engineering Perspective

From a Building Services Engineering standpoint, liquid cooling fundamentally changes how data centres are designed.

Instead of designing around massive airflow volumes, engineers increasingly focus on:

  • Hydronic pipework networks

  • Heat exchanger selection

  • CDU sizing

  • Pump energy optimisation

  • Water treatment

  • Heat recovery opportunities

  • Building Management System (BMS) integration

Mechanical engineers are becoming as important to modern data centres as electrical engineers, particularly as AI drives rack densities beyond 100 kW.

In the final part of this guide, we will examine the benefits of liquid cooling, compare Power Usage Effectiveness (PUE) and Water Usage Effectiveness (WUE), discuss retrofit strategies, evaluate lifecycle costs, and explore how waste heat recovery is shaping the next generation of sustainable data centres.


How Our Consultants Can Help

  • Heat pump assessments

  • BER assessments

  • Part L compliance reports

  • Building energy modelling

Through NEXUS M&E Design, we also deliver:

  • Heat loss calculations

  • Heat pump sizing

  • Radiator and underfloor heating design

  • Mechanical ventilation design

We ensure every system is designed for maximum efficiency, compliance, and long-term performance.

Heat pumps work differently. Rather than generating heat through combustion, they transfer heat from the outside environment into a building. By exploiting the vapour compression refrigeration cycle, heat pumps can deliver three to five times more heat energy than the electrical energy they consume, making them one of the most energy-efficient heating technologies available.


Disclaimer

The content shared in these posts is intended for informational purposes only and should not be interpreted as design advice, specifications, or a calculation template. For professional guidance or design services, please contact us through our contact form.


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